Particle and Aerosol Research Vol. 6, No. 3, September 2010 |
ISSN : 1738-8716 (Print) ISSN : 2287-8130 (Online) |
Research Status on Flexible Electronics Fabrication by Metal Nano-particle Printing Processes
°í ½Â ȯ Ä«À̽ºÆ® ±â°èÇ×°ø°øÇкÎ・ÀÀ¿ë³ª³ë°øÇבּ¸½Ç (2010³â 8¿ù 3ÀÏ Åõ°í; 2010³â 9¿ù 12ÀÏ ¼öÁ¤; 2010³â 9¿ù 25ÀÏ °ÔÀçÈ®Á¤)
Abstracts
Flexible electronics are the electronics on flexible substrates such as a plastic, fabric or paper, so that they can be
folded or attached on any curved surfaces. They are currently recognized as one of the most innovating future technologies
especially in the area of portable electronics. The conventional vacuum deposition and photolithographic patterning
methods are well developed for inorganic microelectronics. However, flexible polymer substrates are generally
chemically incompatible with resists, etchants and developers and high temperature processes used in conventional integrated
circuit processing. Additionally, conventional processes are time consuming, very expensive and not environmentally
friendly. Therefore, there are strong needs for new materials and a novel processing scheme to realize flexible
electronics. This paper introduces current research trends for flexible electronics based on (a) nanoparticles, and (b) novel
processing schemes: nanomaterial based direct patterning methods to remove any conventional vacuum deposition and
photolithography processes. Among the several unique nanomaterial characteristics, dramatic melting temperature depression
(Tm, 3nm particle~150¡ÆC) and strong light absorption can be exploited to reduce the processing temperature and
to enhance the resolution. This opens a possibility of developing a cost effective, low temperature, high resolution and
environmentally friendly approach in the high performance flexible electronics fabrication area.
Keywords£ºMetal Nanoparticles, Flexible Electronics, Printed Electronics, Inkjet Printing, Nanoimprinting, Selective
Laser Sintering
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