Particle and Aerosol Research Vol. 9, No. 4, December 2013 |
ISSN : 1738-8716 (Print) ISSN : 2287-8130 (Online) |
Evaluation of Point‐Of‐Use (POU) Filters Performance in Chemical Mechanical Polishing Slurry Supply System
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Abstracts
The chemical mechanical polishing (CMP) process is widely used in semiconductor manufacturing process for
planarization of various materials and structures. Point‐of‐use (POU) filters are used in most of the CMP processes in
order to reduce the unwanted micro‐scratches which may result in defects. The performance of the POU filter is
depends on type and size of the abrasives used during cleaning process. For this reason, there is a need to evaluate
POU filters for their filtration efficiency (FE) with different types of abrasives. In this study, we developed filter test
system to evaluate the FE of POU using ceria and silica abrasives (slurry). The POU filter is roll type capsule filter
with retention size of 0.2 §. Two POU filters of different make are evaluated for FE. We observed that both POU
filters show similar filtration efficiency for silica and ceria slurry. Results reveal that the ceria slurry and the colloidal
silica particle are removed not only by mechanical way but also hydrodynamic and electrostatic interaction way
Keywords£ºPOU filter, Chemical mechanical polishing (CMP), Silica, Ceria, Slurry
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